We are integrating an X-band SSPA amplifier whose target application will be downstream data transmitters such as constellations of Earth observation satellites. The device is an engineering model that is expected to reach TRL 7…
Recently we completed the PDR (Preliminary Design Review) of the project for European Space Agency – ESA: “Development and Production of a 5-10kW Solid State Power Amplifier at 7.2GHz for Satellite Uplink Communication”. The objective of…
A ballute is a supersonic decelerator, designed for high velocity flow as an alternative to parachutes. Our version was developed to support the re-entry and recovery of PERUN rocket. After months of design and development,…
From 15-17 November 2022, at the Space Tech Expo in Bremen (Germany), we will be showcasing RASEL, PERUN demonstrator and our other solutions in the field of advanced electronics and rocket technologies. Meet us at…
Last week, a conference at the Ministry of Economic Development and Technology celebrated Poland’s 10 years in the European Space Agency – ESA. Ahead of the upcoming ESA Ministerial Council in November, where countries’ participation…
Last week we tested the performance of the Thrust Vector Control (TVC) system, improved after the first flight conducted in August this year. The task of the 10-degree deflected BIGOS 6 rocket was to align…
Between September 12 and 14, SpaceForest took part in the Microwave & Radar Week – MRW2022 conference in Gdańsk. During the conference, SpaceForest’s engineer Jędrzej Michalczyk gave a presentation on an analytical approach to the…
SpaceForest’s autonomous tracking and data transmission system RASEL allows for reliable, long-distance data collection from a rocket or other flying vehicles. Our single-stage guided suborbital launch vehicle PERUN offers mobility and availability to launch from…
Thrust Vector Control – TVC, is one of two control systems of the PERUN rocket. TVC system allows to control the direction of the thrust vector of the main hybrid rocket engine, what enables control…
Wires used to interconnect semiconductor devices or integrated circuits when packaging electronic chips are made of metallic materials such as gold, silver, copper, or aluminum. They require precise wire bonding machines. We are pleased to…