New Wire Bonder in SpaceForest’s cleanroom

Wires used to interconnect semiconductor devices or integrated circuits when packaging electronic chips are made of metallic materials such as gold, silver, copper, or aluminum. They require precise wire bonding machines.

We are pleased to announce that the new wire bonding machine has just arrived at our company and we can make such connections in our clean-room.

About our clean-room:

Our ISO7 cleanroom is a modular construction, currently equipped with three workstations. The air shower and pass-through chamber prevent getting particles inside when personnel enter or the equipment is delivered to the room.

The minimum requirement for the production of space electronics is the ISO8 class according to the ISO 14644-1 standard, which defines the maximum allowable number of solid particles per unit volume of air.

However, we decided to build an ISO7 clean room, ensuring ten times lower concentration of solid particles, and thus even greater air purity inside the room. Thanks to this, we will be able to assemble not only flight models of our satellite components but also manufacture monolithic microwave integrated circuits MMIC.

In addition to our production, we rent our clean-room to other companies, and in the case of electronics production, also experienced engineers to support our customers.

We look forward to working with you!

SpaceForest's engineer using wire bonder.
SpaceForest’s engineer using new wire bonder.